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Items for Author "(Ho-Ming Tong)"
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Collection
Date
Title
Authors
Bitstream
[台中附設醫院] 期刊論文
2014-04
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
(Yu-San Chien)
;
(Yan-Pin Huang)
;
(Ruoh-Ning Tzeng)
;
(Ming-Shaw Shy)
;
(Teu-Hua Lin)
;
(Kou-Hua Chen)
;
(Chi-Tsung Chiu)
;
(Ching-Te Chuang)
;
(Wei Hwang)
;
邱俊誠(Jin-Chern Chiou)
;
(Ho-Ming Tong)
;
(Kuan-Neng Chen)*
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